Product field: communication radar equipment

Layers: 36L high frequency mixed pressure HDI

 Plate thickness: 2.95mm

Size: 1650*650mm/1*1PCS

Process structure: FR-4+R6002, TG170

The minimum mechanical hole is 0.55mm,

Laser hole 0.10mm

Minimum line width line spacing 4/5mil，Surface Treatment: Immersion Tin

Product: 46-layer high-frequency HDI U.S. military product PCBA

Main installation: SMT+plug-in+post-welding

SMT, DIP, TEST, Helpset, assembly as one of the OEM workers, the company currently has 16 SMT production new

YAMAHA) high-speed placement line, with a daily production capacity of 35 million points, automatic inspection equipment: X-RAY, AOI, ICT and other equipment, 4 automatic, can paste the smallest device 0.05mm

Plug-in (AI) equipment, 4 plug-in (DIP) lines, 6 post-solder assembly lines

Product field: US military productsLayers: 42L Japan's Mitsui mc24m + American 3MC-Ply buried capacitance material + mixed pressure buried capacitance material HDIPCB

Plate thickness: 5.60mm±10%;

Process structure: minimum hole 0.10mm, copper thickness 1OZ, line width and line spacing 4/4mil, impedance Ω±10%

Surface treatment: electric gold 5u"

Application: 5G Small Cell Antenna Thickness: 1.60mm Plate: 370HR+l-M6+ RO4450F Minimum Aperture: 0.225mm Laser Hole 0.10mm (Blind Hole) Layers: 10L High Frequency Hybrid HDI Minimum Line Width: Inner Layer 4mil Minimum Line width: Outer layer 4mil Minimum hole copper: 1.6mil Finished surface copper: 1.0mil Shipping size: 152*85.1mm Surface treatment: Immersion gold

Main Product Structure of Chaosheng Group Company

Production of 2-80 layer rigid circuit boards, 2-50 layer flexible circuit boards, and PCBA

Main product categories of Chaosheng Group Company

High end double-sided, multi-layer, flexible, high-frequency, HDI arbitrary interconnection, metal substrate, high thermal conductivity metal substrate, ceramic, cut into metal substrate, cut into buried capacitor, cut into thick copper buried magnet, concave convex step substrate, 5G high-speed board, thick copper, thick gold, high carbon resistance, double-sided multi-layer MiNiLED, MiNiHDILED, MiNiOLED, IC carrier substrate, roll on roll FPC, long FPC, large-sized printed circuit board, halogen-free materials, high-frequency materials, high-speed materials Metal materials, environmentally friendly circuit boards, blind buried through-hole circuit boards, high thermal conductivity aluminum based, thermoelectric separation copper based, PDU bus, iron-based and metal based (core) hybrid boards, embedded copper buried, buried resistance and capacitance ceramic bead boards, ultra-thin BT boards, ceramic substrates, IC carrier boards, high-frequency hybrid voltage, high-speed boards, differential resistance boards, thick copper plates, thick gold-plated plates, HDI, Anylayer in any order (cross blind buried), double-sided, multi-layer, HDIFPC, soft and hard HDI, Integrated OEM and ODM production factories for roll to roll FPC, ultra long FPC, ultra large PCB production and product design and development, software development, and special material printed circuit boards.

The main application areas of PCB and PCBA products of Chaosheng Group Company

Communication terminals, communication stations, electronic communication, fiber optics, optical modules, backlights, chip systems, communication equipment, communication instruments, computers, intelligent devices, intelligent control, system control, industrial power control, industrial equipment, testing instruments, testing instruments, SD cards, SG cards, mobile phones, computers, various antennas, radars, automobiles, light sources, mold proof, music equipment, playback equipment, banking equipment, medical equipment Medical devices, medical equipment, aerospace, aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products, computers and other application fields;

The main application areas of flexible circuit boards (FPC) and FPCA products of Chaosheng Group CompanyHard disk drives, printers, fax machines, scanners, sensors, mobile phones, connectors, modules, walkie talkie antenna cards, high-end cameras, digital cameras, laser heads, CDs, medical, instrument, driver, automotive, automotive instruments, automotive hard drives, drivers, CD drivers, medical equipment, medical equipment, LED light strips, military, aviation, aerospace, national defense and other product fields.

FAQ

Question point answer

Q: What information does the PCB need to provide? CEGSATE: It is necessary to provide the Gberber file for making PCB, the product process production instructions, such as material requirements, surface treatment requirements, finished product thickness requirements, PCB stack structure diagrams for high-end products, copper thickness requirements for each layer, sample quantity requirements, and bulk order requirements , product application fields and other related information

Q: What information does PCBA need to provide? CEGSATE: It is necessary to provide BOM report (requires the brand, specification and model of the component), X, Y coordinate number of PCBA components, and processing requirements: Do you need us to purchase components? Or customer-supplied components? Is software burning required? How much is required? Details such as what is the monthly demand.

Q: Are my documents safe? CEGSATE: Your documents are very secure and we protect intellectual property for our clients throughout the process. All files provided by customers will never be shared with any third party.

Q: How much is the MOQ? CESGATE: There is no MOQ in POE. We have the flexibility to handle both small and large batches.

Q: Do you have other services? CESGATE: We mainly focus on the procurement services of PCB+FPC production+SMT+Assembly PCBA+components; in addition, we can also provide programming, testing, software programming, wiring, shell assembly services; as well as product design, product development, software development

Q: What is your inspection method? How do you control the quality? CESGATE: In order to ensure the quality of PCB and FPC products, samples and small batches are usually detected by flying probe; the inner layer circuit passes AOI optical inspection, online AOI inspection, the finished product is 100% tested by E-SET test frame, and the appearance is fully automatic Finished product inspection equipment 100% full inspection and FQC 100% full inspection, PCBA automatic optical inspection (AOI), BGA parts X-Ray 100% ray inspection, first article inspection (FAI), PCBA products that require programming software, according to product functional requirements, 100% full test through the finished test frame, etc.