Specifications

1.High quality of removing flash and dirty thoroughly
2.Adopt high pressure pump
3.Removing flash inside boring hole

Application:
It is used for removing flash inside the boring hole of circuit board and on the surface of the oxidation coating. It adopts high pressure pump which the pressure can be reached 30kg/cm2. So it can remove the flash and the dirt thoroughly, which ensure the quality of the boring hole.

Process Flow:
Put the plate—swing the 4 rolls brush—recycle water washing i/ii—high pressure washing—urban water
washing—absorb—blow—dry-discharge

 

Main Parameter: 1 Outline dimension 6750mm*1600mm*2000mm 2 Work height 900mm 3 Work width 640mm 4 Work speed 0-5m/min 5 Power supply 3 phases/4 wire 380V 50HZ 6 Total power 28KW 7 Max workpiece 600mm*any dimension 8 Min workpiece 80mm*120mm 9 Thickness 0.4~2.5mm 10 Water consumption 8~12 L/mil