Pre-treatment Before Hot Air leveling
Negotiable /Set
Min.Order:1 Set
Changzhou Techelect Electronic Equipment Co., Ltd.
Pre-treatment Before Hot Air leveling
Characteristics:
It is used for pre-treatment before hot air leveling, which can keep the surface of the copper foil and the holes wall clean, activation and coarsening. So it ensures the eveness and leveling of the PCB tin solder.
Process Flow
Put the plate—etching—recycle water washing—hi-pressure water washing—clean water washing—dry the plate—check—apply flux
Main Parameter:
1 | Work table width | 640mm |
2 | Work Height | 900±25mm |
3 | Convey Speed | 0-5m/min |
4 | Application | Max:600mm*any dimension Min: 80mm*120mm |
5 | Thickness | 0.4-2.5mm |