Specifications

1.Wet chemical removal of the phosphorous glass layer
2.Efficient and gentle
3.Homogeneous and reproducible

PSG Removal and cleaning

Application:
Wet chemical removal of the phosphorous glass layer (PSG).Features and Benefits

• Efficient and gentle processing of the cells
• Using advanced PID temp. control system
• Drying process without water marks
• Homogeneous and reproducible process
• End-to-end inline processing

Technical Data

• Standard Outline dimension:
  10500*2000*2200 (length*width*heigh)
• Throughput:
  2100 for 125mm wafers/h gross, 1800 for 156mm wafers/h gross
• Thickness: >150um