Kinder Wafer Biscuit Equipment
USD $90,000 - $120,000 /Set
Min.Order:1 Set
Kehua Foodstuff Machinery Industry And Commercial Co., Ltd.
Kinder Wafer Biscuit Equipment
Wafer Biscuit Equipment For 33 Plates
Description:
After sales service:
Equipment & process of wafer biscuit machine:
Kinder wafer biscuit equipment
Production process of wafer biscuit equipment:
batter mixing----wafer baking----cooling----cream spreading----book cooling----cutting
Equipments of wafer biscuit equipment:
1.batter mixer 2.oven nnecting machine 4.vertical type cooler llecting machine 6.cream spreader 7.wafer conveyor 8.wafer cutter 9.cream mixer 10.wafer smashing machine.
The real pictures of waer biscuit equipment:
Wafer pictures(by wafer biscuit equipment):
3. Specialty & Using:
Products Distinguishing Feature:
Wafer biscuit equipment:
Using: Wafer biscuit production line is exclusively used in produce different kind of good wafer.
4. Technical advantage:
(1) In the field of wafer biscuit production line have more than 15 years experiences.
(2) According to HACCP design, the controlling and operating for the important equipment will be more accurately and safely.
(3) Have CE, ISO9001:2000, FM.
(4) Professional design, material selection more scientifically, processing more accurately.
(5) Good quality.
(6) Best service and perfect after sale service.
5. Technical Parameter:
Wafer biscuit production line:
Name | Dimension(L*W*H) | Weight | Power | LNG consumption | Air compression consumption(per hour) | Rated power | Capacity |
Wafer biscuit equipment for 33 plates | 18.3m*1.8m*2.6m | 14tons | 5.15kw | 18.2kg/h | 36m3 | 30kw | 119kg/h |
[1] Baking oven's length(m)---6m;
[2] The complete line's length(m)---17.9m;
[3] The total weight of wafer line(T)---13T;
[4] Power(kw)---5.15kw;
[5] LNG consumption(m3/h)---21m3/h;
[6] Air compression consumption(m3/h)---36m3/h;
[7] Capacity(kg/h)---119kg/h.
Parameter:
1) The standard size of the baking plate is 470*325mm; Pattern(standard) is 2.5*2.5*0.5mm;
2) The size of wafer sheet is 464*321mm; The effective cutting size of wafer sheet is 456*315mm;
3) Wafer sheet's thickness: 2.5mm---3.2mm;
4) Weight of wafer sheet: 50---60g;
5) Rated power: 30kw;
6) Air compression consumption: 0.9cube/minute;
7) Baking time about 2 minutes;
8) Worker: 4 to 5 people.
Space: machines using 60 square meter
6.Packaging & Container
1. Packaging: iron and waterproof membrane.
2. Container: one 40'HQ.
[Note]: We can make different pattern for the plate according to client's demands.