1. Product Description

1. XBQ-BP series is made of an advanced thermal conductive pressure sensitive adhesive.

2. XBQ-BP series provides a better way for applications requiring good adhesion strength and superior thermal conductive efficiency.

 3. XBQ-BP series is widely applied to electronic mechanical components assembly such as the heat sink module and LED light bar module and heat sink or other cooling devices.

2. Advantages

1. Superior adhesion strength and thermal conductive efficiency.

2. Various kinds of thickness (0.10mm,0,15mm,0.20mm,0.25mm,0.30mm,0.50mm)

3. Various structures are for different applications.