Specifications

- Dicing, protecting wafers
- UV curing type
- Improved back side chipping, contamination by water

Feature:

*Wafer dicing, Wafer protection

*UV curing type

*Expandable type

*Precented dicing wafer from penetrating into interface

*Improved back side chipping

*Improved back side contamination by wafer

*Adhesive strength depends on chip size, chip thickness,etc

 

Specification:

 

Tape Color:  White

Tape Thickness: 130um

Base Film: Polyolefin/100um

Adhesive: 30um

Adhesion before UV: 3.00 N/10mm

Adhesion after UV: 0.22 N/10mm

 

 Note:  UV irradiation should be satisfied the following conditons in order to ensure the standard value

1) more than 100mW/cm2 of illuminance

2) more than 200mJ/cm2 of quantity of UV light

3) Wave length of ultraviolet should be around 365nm