Specifications

1.UV dicing tape, easily peeled off after UV treatment
2.wafer dicing, wafer protecting
3.PO backing

 

  

 Product Features:

 

-Wafer dicing, wafer protection

-Expandable type

-Prevent dicing wafer from penetrating into interface

-Improve back side chipping

-Improve back side contamination by wafer

-The adhesive strength depends on chip size, chip thickness etc.

 

 

 Note: UV irradiation should confirm the following condition in order to ensure the expected efficiency.

 

-More than 100mW/cm2 of illumination

-More than 200mJ/cm2 quantity of UV light

-Wave length of ultraviolet should be around 365nm