LED Wafer High Precision UV Laser Scribing Machine Price

Application

Mainly used in the LED sapphire substrate wafer cutting

Technology Characters:

One button operation, fully automatic operatiion of the dicing process;

High precision linear motion platform, the marble pedestal bearing table, the focal length automatically adjusts the body;

Automatic positioning system of the CCD image recognition can be back cut tangent;

Anti-coarsening of the visual system;

Software to automatically identify the template, angle correction, automatic contour to find the contour correction;

High reliability, low maintenance and operating costs;

The dicing process, the software automatically correct bar code reading, production data statistics and other features.

Samples: