Sapphire Wafer Cutting Machine

Sapphire Wafer Cutting Machine

USD $1 - $250,000 /Set

Min.Order:1 Set

Supply Ability:
500 Set / Sets per Month
Port:
Shanghai/Be appointed
Payment Terms:
T/T L/C D/P D/A Credit Card PayPal

Quick Details View All >

Condition:
New
Laser Type:
Diode
Applicable Material:
Other, Sapphire Substrates
Cutting Thickness:
20-30um±2um
Cutting Area:
2",4"
Cutting Speed:
80-130mm/s

Jiangsu Keyland Laser Technology Co., Ltd.

Credit Member 4 years
Business Type: Manufacturer
Wuhan Hubei China
Main Products: Solar Equipment Solar Panel Making Line Equipment ,Solar Cell Tester ,Solar Cell Scribing Machine ,Solar Simulator ,Solar EL Defector ,Laser Machine Laser Marking Machine ,Laser Cutting Machine ,Laser Engraving Machine

Product Details

                   Sapphire Wafer Cutting Machine

Sapphire Wafer Cutting Machine

 

UV Laser Cutting  machine is  high-end precision processing equipment to cut LED Sapphire and sapphire substrate epitaxial wafer . 

 

UV Laser Cutting  machine 's Application:

@Display backlight

@Car

@ Business decorative landscape lighting road lights 

@ Home decorative lighting products

@System controller:LED screen,LED outer

 

Character of UV Laser Cutting  machine :

1.One-button operation, fully automatic operation

2.High-precision linear motion platform(imported)

Sapphire Wafer Cutting Machine
3.Marble working table
4.Adjust Focal length automatically
5.CCD Auto-image identify & positioning system, face & back cutting

6.Anti-coarsening visual system
7.Identify Software template automatically, angle correction, auto seek& correct contour

8.High reliability, low maintenance&operating cost
9.Software correct automatically,bar code read, product data record

 Sapphire Wafer Cutting Machine

 

LED Sapphire UV laser cutting machine

Type

UV laser cutting

Cutting size

2”,4”

Laser type

Semicon solid laser Adjust Q

Laser wavelenght

355nm

System

X-Y repeated precision

≤±0.5um

X-Y repeated Positioning

≤±1um

Q axis

15 arc-sec

Range travel

X-Y axis

200mm

Z axis

20mm

 

Cutting depth

20-30um

Cutting speed

80-130mm/s

Cutting linear width

8um

 

Ambient temperature

20-25C

Relative humidity

20%-60%

air compression

0.5-0.8mpa

Power

220V/15A/50-60HZ

Machine size

1200*1100*1600mm

Machine Weight

1000KG

level of automation

Automatic Fully

Control System

PC control

 

Sample:

Sapphire Wafer Cutting Machine

 

 

Contact Supplier

Mr. keyland laser Chat Now
Telephone
86-27-87970567
Address
Block B, Phoenix Park, Changzui Industrial Park, Gaoxin 6th Road, East Lake Development Zone Wuhan,Hubei

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