LED Wafer High Precision UV Laser Scribing Machine Price
USD $10,000 - $150,000 /Set
Min.Order:1 Set
Jiangsu Keyland Laser Technology Co., Ltd.
LED Wafer High Precision UV Laser Scribing Machine Price
Application
Mainly used in the LED sapphire substrate wafer cutting
Technology Characters:
One button operation, fully automatic operation of the dicing process;
High precision linear motion platform, the marble pedestal bearing table, the focal length automatically adjusts the body;
Automatic positioning system of the CCD image recognition can be back cut tangent;
Anti-coarsening of the visual system;
Software to automatically identify the template, angle correction, automatic contour to find the contour correction;
High reliability, low maintenance and operating costs;
The dicing process, the software automatically correct bar code reading, production data statistics and other features.
Main Technical parameters:
Processing type | |
Processing type | UV cut |
Optical parameters | |
Laser wavelength | 355nm |
Type of laser | Q-semiconductor solid-state lasers |
Operating parameters | |
Repeatability of the X-Y axis | ≤±0.5 um |
X-Y-axis positioning accuracy | ≤±0.1 um |
Z-axis positioning accuracy | 15 arc- sec |
The X-Y axis | 200mm |
Z-axis | 20mm |
Cutting parameters: | |
Cut to size | 2", 4" |
Cutting depth | 20~30um ±2um |
Cutting speed | 80~130mm/s |
Cutting line width | 8um |
Other parameters | |
Ambient humidity | 20~25 °C ± 2 °C |
Absolute humidity | 20%~60% ( Non-condensing) |
Compressed air | 0.5~0.8 Mpa |
Power | 220V 15A/ 50~60Hz |
Dimensions | 1200*1100*1600mm |
Machine weight | 1000kg |
Degree of automation | Fully automatic |
Control system | PC control |