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Product Details

Product Description

Laboratory High Vacuum Magnetron Plasma Sputtering Coater/Magnetron sputtering equipment with DC/RF power

Application of Magnetron sputtering equipment

CY-600-2HD is a magnetron sputtering system featuring dual target sources:

1) DC source for coating metallic material on one head and

2) RF source for coating non-metallic material on the other head. It is equipped with a film thickness tracker to enable the user to easily monitor the coating progress and also record the data.

Features of Magnetron sputtering equipment

1.Hinged type cover on top with air spring sport makes target exchange easy

2.Two precision digital MFC (mass flow controller) are installed to allow two types of gases to be filled in

3.touch screen control panel

4.Made in Germany high speed turbo vacuum pump system

Technical of Magnetron sputtering equipment

Input Power	1.220VAC 50/60Hz, single phase 2.2000W (including pump)
Source Power	1.Two sputtering power sources are integrated into one control box
	2. DC source: 500W for coating metallic materials
	3.RF source: 600W with automatching for coating non-metallic materials ( Center)
	4.Compact 300 RF source is available at extra cost
Magnetron Sputtering Head	1.Two 2" Magnetron Sputtering Heads with water cooling jackets are included One is connected to RF power supply for no-conductive materials Another is connected to DC sputtering power source for coating metallic materials
	2.Target size requirement: 2" diameter
	3.Thickness Range: 0.1 - 5 mm for both metallic and non-conductive targets
	4.One stainless steel and one Al2O3 ceramic targets are included for demo testing
	5.Head Water Cooling: 10ml/min water flow required, and one 16ml/min digitally controlled recirculating water chiller is included for cooling both magnetron sputtering heads
	6.Customized coater: Two DC head without, RF sputtering, RF head without DC sputering,3 RF head are available upon request
Vacuum Chamber	1.Vacuum Chamber: 300 mm Dia x 300 mm height, made of stainless steel
Vacuum Chamber	2.Observation Window: 100 mm diameter
Sample Holder	1.Sample holder size: 140mm dia. for. 4" wafer max
	2.Sample holder rotation speed is adjustable: 1 - 20 rpm for uniform coating
	3.The holder temperature is adjustable from RT to 500°C Max with accuracy +/- 1.0 °C
Gas Flow Control	1.Flow rate: 200 ml/min max.
Gas Flow Control	2.Flow rate is adjustable on the 6" touch screen control panel
Vacuum Pump Station	High speed turbo vacuum pump system is directly installed on the vacuum chamber for max. vacuum level
	Heavy duty dual stage mechanical pump is connected to turbo pump for faster pump speed
	Mobile pump station is included and the compact sputtering coater can be put on top of station
	Max. vacuum level: 10^-6 torr with chamber baking
Thickness Monitor	One Precision quartz thickness sensor is built into the chamber to monitor coating thickness with accuracy 0.10 Å
	LED Display Unit outside chamber can:
	Input material to be coated according to data base included
	Display total thickness coated and coating speed
	5 pcs quartz sensors (consumable) are included
	Water cooling is required
Overall Dimensions	L1300mm× W660mm× H1200mm
Application Note	In order to remove oxygen from the chamber, suggest you use 5% Hytrogen + 95 % Nitrogen to clan chamber 2-3 times, which can reduce oxygen to below 10 ppm
Application Note	Please use > 5N purity Argon gas for plasma sputtering. Even though 5N purity Ar, usually contain 10- 100 ppm oxygen and H2O
Net Weight	160 kg
Warranty	One years limited warranty with lifetime support