Coraynic Technology Limited established in Dec 2018, a professional advanced ceramic materials supplier in China. a reliable BeO ceramic substrate manufacturer representative, BeO ceramic rod, high thermal conductivity beryllium ceramic crucible.Si3N4 ceramic substrate,HTCC,LTCC.In the base of state-owned enterprise, government military background company, high technology research institute of China electronics technology.With more than 50 professional employees in ceramic and electronics Engineering&Technology.Equipped with advanced analyzing instruments and test facilities, such as thermal conductivity meter, laser particle analyzer, Universal tool microscope, ICP Plasma spectrometer, Intensity test meter, rough meter, etc.

The team devoted to developing advanced ceramics and components made in China. Which are encouraged and supported by the nation. A series of high-tech enterprises with complete systems of raw materials, sintering, processing, and assembly, integrating scientific research, production, operation, and service.

BeO ceramic materials. BeO has high thermal conductivity, high melting point (2530 ± 10°C), high strength, high insulation, high chemical, and thermal stability, low dielectric constant, low dielectric loss, and good adaptability properties, etc. Widely used in special metallurgy, vacuum electronics, nuclear technology, microelectronics, and optoelectronics. Especially in high-power semiconductor devices, integrated circuits, package microwave vacuum devices, and nuclear reactors,

Aluminum Nitride (AlN) ceramics and components, High thermal conductivity (theoretic value 280W/m.K), high electric resistance, low coefficient of heat expansion(4.5X10-6℃) good march with Si(3.5~4×10-6℃) and GaAs(6×10-6℃), Excellent electrical properties(Dielectric constant, dielectric loss, bulk resistivity, dielectric strength). features an extremely interesting combination of very high thermal conductivity and excellent electrical insulation properties. This makes aluminum nitride predestined for use in power and microelectronics applications. For example, it is used as a circuit carrier (substrate) in semiconductors or as a heat-sink in LED lighting technology or high-power electronics and renewable energy.

HTCC/LTCC High /Low-Temperature Co-fired Ceramic material. Co-fired ceramic devices are fabricated using a multi-layer approach. The starting material is composite green tapes, consisting of ceramic particles mixed with polymer binders. The tapes are flexible and can be machined, for example using cutting, milling, punching, and embossing. Multilayers based on Low or High-Temperature Co-fired Ceramics (LTCC/HTCC) have a wide range of applications in different fields of electronics and Microsystems. With its ability to become a three-dimensional structure. It is possible to integrate electrical circuits, to build up mechanical, fluidic or optical-based sensory solutions and to realize ceramic packages for Si-based Logic or MEMS.