Company Details
- Business TypeManufacturer
- Employ Number11-20 People
- Year Established2011
- Main MarketNorth America
South America
Eastern Europe
Southeast Asia
Africa
Oceania
Mid East
Eastern Asia
Western Europe
Central America
Northern Europe
Southern Europe
South Asia
Domestic Market
Company Introduction
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Widely used in the Chip Level Repair in laptop, PS3,PS4,XBOX360, Moblie Phone, etc. Rework BGA,CCGA, QFN, CSP, LGA, Micro SMD,LED etc. Automatic Romoving,Mounting and Soldering. HD Optical Alignment system for precisely mounting BGA and Components. Laser Positioning function for Fast Positioning BGA Chip and motherboard. BGA mounting accuracy within 0.01mm , Repair success rate 99.9%. Superior Safety Functions, with Emergency protection. User-friendly operation system.
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