SiC Wafer 930um Thickness Manufacturer No lapping no polishing

Are you looking for thickest SiC Substrate wafer? come and have a look at HMT Unpolished SiC wafer with 400um 600um and 930um thickness for your select. As-cut SiC wafer can be used for diamond wheel grinding, lapping and polishing testing. 

Some SiC substrate manufacturers use grinding wheel thinning, the current commonly used grinding wheel is 2000# coarse grinding, 8000# fine grinding. The process scheme has the advantages of flexible processing, high stability and simple process. However, since the wafer is in vacuum during the thinning process, it is not conducive to the repair of Bow/Warp. In addition, the wear ratio of domestic grinding wheel is large, the processing cost is high, and more rely on imports.