6 inch SiC raw cut wafer with thickness 600um manufacturer for grinding wheel
Negotiable /Piece
Min.Order:10 Pieces
6 inch SiC raw cut wafer with thickness 600um manufacturer for grinding wheel
China Raw cut SiC wafer manufacturer HMT produces 2 inch to 8 inch SiC wafers with no lapping and no polishing slicing wafer. We have different thickness like 600um 900um 1100um etc. We support customized As-cut SiC wafer thickness. We provide competitive price of unpolished SiC wafer on the market. Please contact us now.
Features:
Product Name: As-cut SiC Wafer
Back: C Face
Customized: Support
Dopant: N-type Nitrogen
Resistivity: 0.015-0.028 Ohm-cm
Poly type: 4H