PCT saturated high voltage accelerated aging test chamber is mainly used to test the moisture capacity of semiconductor packaging. The product to be tested is tested under harsh temperature, humidity and pressure. Moisture will penetrate into the package along the colloid or the interface between colloid and conductor frame. The common failure modes are open circuit caused by corrosion in active metallization area, or short circuit caused by pollution between package pins, etc. It is accomplished by accelerating the penetration of moisture through external protective materials or sealants or between external materials and conductors by continuously applying pressure under set temperature and humidity conditions.