Resin bond Diamond Cylindrical Grinding Wheel for HVOF ceramic coating
Description of the Resin bond Diamond Cylindrical Grinding Wheel for HVOF ceramic coating:
Resin bond diamond wheels are mainly used for grinding tungsten carbide and non-metal materals.
Various kinds of dimensions and shapes are available, such as flat shapes, cup shapes and dish shapes, etc.
Feature/Benefit of the Resin bond Diamond Cylindrical Grinding Wheel for HVOF ceramic coating
1. Good free-cutting
2. Good Abrasion Resistance
3. Availability in a broad range of applications in both Dry and Wet Conditions
4. Improved Heat Resistance(Polyimide Series)
Application of the Resin bond Diamond Cylindrical Grinding Wheel for HVOF ceramic coating:
1. Surface grinder,
2. PCD/PCBN tools grinding,
3. Tungsten carbide grinding,
4. Glass grinding
5. Stone grinding
Specification of Resin bond Diamond Cylindrical Grinding Wheel for HVOF ceramic coating:
Type: 1A1, 3A1,9A1,14A1 etc.
Diameters: 25mm-1000mm
Thickness: 5mm-250m
Grit: 50# -2000#
Hole: according to the customer requirement
Concentration: 100, 125
to meet your requirements in every way, we need the following information
----- Shape and Dimension of the wheels
----- Grit size (Mesh, refer to Table#1)
----- Concentration
----- Bond(Resinoid, Vitrified, Metallic, Electroplated)
----- Quantity
