Resin bond Diamond Cylindrical Grinding Wheel for HVOF ceramic coating

Description of the Resin bond Diamond Cylindrical Grinding Wheel for HVOF ceramic coating:

Resin bond diamond wheels are mainly used for grinding tungsten carbide and non-metal materals. 

Various kinds of dimensions and shapes are available, such as flat shapes, cup shapes and dish shapes, etc.

Feature/Benefit of the Resin bond Diamond Cylindrical Grinding Wheel for HVOF ceramic coating

1. Good free-cutting

2. Good Abrasion Resistance

3. Availability in a broad range of applications in both Dry and Wet Conditions

4. Improved Heat Resistance(Polyimide Series)

Application of the Resin bond Diamond Cylindrical Grinding Wheel for HVOF ceramic coating:

1. Surface grinder,

2. PCD/PCBN tools grinding,

3. Tungsten carbide grinding,

4. Glass grinding

5. Stone grinding

Specification of Resin bond Diamond Cylindrical Grinding Wheel for HVOF ceramic coating:

Type: 1A1, 3A1,9A1,14A1 etc.

Diameters: 25mm-1000mm

Thickness:  5mm-250m

Grit: 50# -2000# 

Hole: according to the customer requirement

Concentration: 100, 125

to meet your requirements in every way, we need the following information

----- Shape and Dimension of the wheels

----- Grit size (Mesh, refer to Table#1)

----- Concentration

----- Bond(Resinoid, Vitrified, Metallic, Electroplated)

----- Quantity