High Concentration 200mm Ceramic Bond Diamond Abrasive Grinding Wheel

Ceramic Bond Diamond Grinding Wheel

With high strength, good wear resistance, sharp cutting, high grinding efficiency, seldom heat and clogging, small thermal expansion and easy control of processing precision, the demand of ceramic bond diamond grinding wheel is increasing in the world’s grinding industry.  Also, the ceramic bond grinding wheel has longer service life, which can cut freely, trim & grind by itself, and improve the grinding efficiency markedly, is the best choice for automatic equipment grinding.

It can be divided into following types: Flat shape, Cup shape, Bowl shape, Dish shape etc..

Application: Widely applied in mechanical processing of high hardness and brittle materials, such as wafer ( semiconductor silicon wafer and solar silicon wafer ), PDC(polycrystalline diamond compact), PCD(polycrystalline diamond), diamond cutting tools, CBN(cubic boron nitride), cemented carbide, new engineering structure ceramics, gemstone, crystal and rare earth material etc..

Features :

1. High grinding efficiency, small thermal expansion, seldom heat and clogging while grinding;

2. High strength, good wear resistance: with good wear resistance and less abrasive consumption, and the character is most distinct while in grinding of high hardness & brittle materials;

3. Small grinding force, low grinding temperature;

4. The workpiece is with high precision, good surface quality and good shape retention which grinding finished;

5. Longer service life .

Customization of Diamond Grinding Wheel

If you need to customize, please provide following:

1. Dimensions, include outer diameter, bore diameter, thickness, width and thickness of abrasive layer ;

2. Abrasive, abrasive grit size and concentration ;

3. Bonding agent ;

4. Application of wheel ;

5. Picture and drawing of wheel ;

Then quotation can be sent. Thanks