Functions: Suitable for packaging materials with high power devices, such as substrates, lower electrodes, high performance lead frames, thermal control boards and radiators of military and civil thermal control devices, etc.

Characteristic: It not only has low expansion of tungsten, but also has high thermal conductivity of copper. Especially, its thermal expansion coefficient and thermal conductivity can be designed by adjusting the composition of materials

If necessary, you can contact any cemented carbide products directly by mail.

Netease mailbox: Kaishi14581@163.com