back grinding Wheel for inserts

China Supplier Back Thinning Diamond Grinding Wheel For Silicon Wafer

Silicon wafer back grinding wheels are mainly used for the thinning and fine grinding of the silicon wafer.

Coolant: Oil, emulsion

workpiece processed: silicon wafer of discrete devices, integrated chips (IC) and virgin,ATM, Melchiorre, Peter Wolters, Diskus, Viotto, Wendt

Material of workpiece: monocrystalline silicon and some other semiconductor materials.

Specifications

1.be used with Japanese, German, American, Korea and Chinese grinders 
2.superior grinding performance 

3.high cost performance

Application: back thinning, grinding and fine grinding.

The grinding wheels for LED substrate are mainly used for back thinning of sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer.

Workpiece processed: sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer.

Material of workpiece: synthetic sapphire, single crystal silicon, gallium arsenide and GaN materials. 

Grinders: SHUWA SGM-6301, NTS Nanosurface-180G, NTS Nanosurface 250/NC-VDM

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