Silicon Wafer back Grinding wheels for thinning and fine grinding
USD $1 - $100 /Piece
Min.Order:1 Piece
Silicon grinding wheel
The silicon grinding wheels are mainly used for thining and fine grinding of the silicon wafer. These products produced by our company which possess superior grinding perfomance and high cost performance.
This kind of grinding wheel developed in China can be used with the Japanese, German, American, korean and Chinese grinders.
Workpiece processed: silicon wafer of discrete devices, integrated chips and so on
Material of workpiece: monocrystalline silicon and some other semiconductor materials
Applications: back thining , rough grinding and fine grinding
Silicon Wafer back Grinding wheels for thinning and fine grinding
Shape code | Profile Sketch | Conventional Specification (mm) | ||
Out diameter D | Thickness T | Hole diameter H | ||
6A2 | 175 | 30, 35 | 76 | |
200 | 35 | 76 | ||
375 | 40 | 127 | ||
6A2T | 195 | 22.5, 25 | 170 | |
280 | 30 | 228.6 | ||
350 | 35 | 235 | ||
6A2T- | 209 | 22.5 | 158 |
Silicon wafer back grinding wheels are mainly used for the thinning and fine grinding of the silicon wafer.
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