Non-Silicone Putty GEL thermal conductive thermal interface material
Negotiable /Piece
Min.Order:500 Pieces
Introduction
Syringes packaging, automated production, high temperature, non-corrosive metal, 100% thermal curing putty. XK-GN series a high performance thermal Gel , it base on TPR, Filled with a variety of high-performance ceramic powder made. It also has a high thermal conductivity, low thermal resistance, in the heat sink affixed good. Good insulation can be infinitely compression characteristics.
Features
Have enough compressibility
Non-silicone
non-curing
Resists pump-out
Applications
Consumer electronics.
Automotive Systems.
Telecommunications.
Thermal Conductivity | W/mK | 1.4 | 2 | 3 | HOT DISK |