PCB Board Assembly, buy FR4 Double Side Multi-Layer PCB Board Assembly Immersion Gold Printed Circuit on China Suppliers Mobile

Product Details

Delivery Time:6-8 DAYS
Certification:UL,ISO9001:2008,ROHS,REACH, HALOGEN FREE,SGS

FR4 Double Side Multi-Layer Immersion Gold Printed Circuit Board Assembly

PRODUCT’S DETAILS
Raw Material	FR-4 (Tg 180 available)
Layer Count	4-Layer
Board Thickness	1.0mm
Copper Thickness	2.0oz
Surface Finish	ENIG(Electroless Nickel Immersion Gold)
Solder Mask	Green
Silkscreen	White
Min. Trace Width/Spacing	0.075/0.075mm
Min. Hole Size	0.25mm
Hole Wall Copper Thickness	≥20μm
Measurement	300×400mm
Packaging	Inner: Vacuum-packed in soft plastic bales Outer: Cardboard Cartons with double straps
Application	Communication,automobile,cell,computer,medical
Advantage	Competitive Price,Fast Delivery,OEM&ODM,Free Samples,
Special Requirements	Buried And Blind Via, Impedance Control, Via Plug, BGA Soldering And Gold Finger Are Acceptable
Certification	UL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE

PRODUCTION CAPABILITY OF PCB
PROCESS Engineer	ITEMS Item	PRODUCTION CAPABILITY Manufacturing Capability
Laminate	Type	FR-1,FR-5,FR-4 High-Tg,ROGERS,ISOLA,ITEQ, ALUMINUM,CEM-1,CEM-3,TACONIC,ARLON,TEFLON
Thickness	0.2～3.2mm
Production Type	Layer Count	2L-16L
Surface Treatment	HAL,Gold Plating,Immersion Gold,OSP, Immersion Silver,Immersion Tin,Lead Free HAL
Cut Lamination	Max. Working Panel size	1000×1200mm
Inner Layer	Internal Core Thickness	0.1～2.0mm
Internal width/spacing	Min: 4/4mil
Internal Copper Thickness	1.0~3.0oz
Dimension	Board Thickness Tolerance	±10%
Interlayer Alignment	±3mil
Drilling	Manufacture Panel Size	Max: 650×560mm
Drilling Diameter	≧0.25mm
Hole Diameter Tolerance	±0.05mm
Hole Position Tolerance	±0.076mm
Min.Annular Ring	0.05mm
PTH+Panel Plating	Hole Wall copper Thickness	≧20um
Uniformity	≧90%
Outer Layer	Track Width	Min: 0.08mm
Track Spacing	Min: 0.08mm
Pattern Plating	Finished Copper Thickness	1oz～3oz
EING/Flash Gold	Nickel Thickness	2.5um~5.0um
Gold Thickness	0.03~0.05um
Solder Mask	Thickness	15～35um
Solder Mask Bridge	3mil
Legend	Line width/Line spacing	6/6mil
Gold Finger	Nickel Thickness	≧120u〞
Gold Thickness	1～50u〞
Hot Air Level	Tin Thickness	100～300u〞
Routing	Tolerance of Dimension	±0.1mm
Slot Size	Min:0.4mm
Cutter Diameter	0.8～2.4mm
Punching	Outline Tolerance	±0.1mm
Slot Size	Min:0.5mm
V-CUT	V-CUT Dimension	Min:60mm
Angle	15°30°45°
Remain Thickness Tolerance	±0.1mm
Beveling	Beveling Dimension	30～300mm
Test	Testing Voltage	250V
Max.Dimension	540×400mm
Impedance Control	Tolerance	±10%
Aspect Ration	12:1
Laser Drilling Size