Delivery Time:8-10 DAYS
Certification:UL,ISO9001:2008,CE,ROHS,REACH,HALOGEN FREE,SGS

 
4-Layer Double Sided PCB FR4 ENIG Immersion Gold Custom Printed Circuit Board PCB
 
Quick Details

One of the largest PCB(Printed Circuit Board) manufacturers in China with over 500 staff.Professional PCB manufacturers in China with 20 years’ experience.Certifications of ISO9001:2008,UL,CE,ROHS,REACH,HALOGEN-FREE is meet.Good quality with competitive price for all kinds of PCB manufactured by SYF.BGA,Blind&Buried Vias and Impedence Control is accepted.One-stop service of PCB with assembly is supplied to our customers.Best service with quick response is always provided for our customers.All kinds of surface finish is accepted,such as ENIG,OSP.Immersion Silver,Immersion Tin, Immersion Gold, Lead-free HASL,HAL.Advanced production equipment imported from Japan and Germany,such as PCB Lamination Machine, CNC drilling machine,Auto-PTH line, AOI(Automatic Optic Inspection),Probe Flying Machine and so on.

 
Characteristics:
 
1. Professional PCB manufacturer.
2. PCBA,OEM,ODM service are provided.
3. Gerber file needed.
4. Products are 100% E-tested.
5. Quality guarantee and professional after-sale service
 

PRODUCT’S DETAILS
Raw Material	FR-4
Layer Count	4-Layer
Board Thickness	1.0mm
Copper Thickness	2.0oz
Surface Finish	ENIG(Electroless Nickel Immersion Gold)
Solder Mask	Blue
Silkscreen	White
Min. Trace Width/Spacing	0.075/0.075mm
Min. Hole Size	0.25mm
Hole Wall Copper Thickness	≥20μm
Measurement	300×400mm
Packaging	Inner: Vacuum-packed in soft plastic bales Outer: Cardboard Cartons with double straps
Application	Communication,automobile,cell,computer,medical
Advantage	Competitive Price,Fast Delivery,OEM&ODM,Free Samples,
Special Requirements	Buried And Blind Via, Impedance Control, Via Plug, BGA Soldering And Gold Finger Are Acceptable
Certification	UL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE

PRODUCTION CAPABILITY OF PCB
PROCESS Engineer	ITEMS Item	PRODUCTION CAPABILITY Manufacturing Capability
Laminate	Type	FR-1,FR-5,FR-4 High-Tg,ROGERS,ISOLA,ITEQ, ALUMINUM,CEM-1,CEM-3,TACONIC,ARLON,TEFLON
Thickness	0.2～3.2mm
Production Type	Layer Count	2L-16L
Surface Treatment	HAL,Gold Plating,Immersion Gold,OSP, Immersion Silver,Immersion Tin,Lead Free HAL
Cut Lamination	Max. Working Panel size	1000×1200mm
Inner Layer	Internal Core Thickness	0.1～2.0mm
Internal width/spacing	Min: 4/4mil
Internal Copper Thickness	1.0~3.0oz
Dimension	Board Thickness Tolerance	±10%
Interlayer Alignment	±3mil
Drilling	Manufacture Panel Size	Max: 650×560mm
Drilling Diameter	≧0.25mm
Hole Diameter Tolerance	±0.05mm
Hole Position Tolerance	±0.076mm
Min.Annular Ring	0.05mm
PTH+Panel Plating	Hole Wall copper Thickness	≧20um
Uniformity	≧90%
Outer Layer	Track Width	Min: 0.08mm
Track Spacing	Min: 0.08mm
Pattern Plating	Finished Copper Thickness	1oz～3oz
EING/Flash Gold	Nickel Thickness	2.5um~5.0um
Gold Thickness	0.03~0.05um
Solder Mask	Thickness	15～35um
Solder Mask Bridge	3mil
Legend	Line width/Line spacing	6/6mil
Gold Finger	Nickel Thickness	≧120u〞
Gold Thickness	1～50u〞
Hot Air Level	Tin Thickness	100～300u〞
Routing	Tolerance of Dimension	±0.1mm
Slot Size	Min:0.4mm
Cutter Diameter	0.8～2.4mm
Punching	Outline Tolerance	±0.1mm
Slot Size	Min:0.5mm
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