Black soldermask white silkscreen 10 layer pcb board high TG gold plating electronic board 1, the resin plug hole diameter: min 0.30mm; maximum 0.75mm (mean pore diameter drill bit)2, the resin stopper plate thickness: the thinnest 0.5mm; the thickness of 3.5mm (plug hole refers to a resin layer thickness)3, the resin plug hole thickness to diameter ratio: maximum 8: 14, the resin plug hole hole spacing: Min 0.4mm5, if the presence of different pore diameter of resin required to plug holes in the same plate, the maximum difference between the hole and the hole no more than 0.3mm, such as the need to step beyond the plug hole 0.3mm, in order to plug the hole first and then plug big holes in principle.6, non-Via-in-Pad resin orifice plug, plug hole of the porous resin member with hole spacing to be> 3.5mm, prevents the plug hole into the process oleoresins element bore. 10 layer pcb board high TG gold plating electronic board：Competitive Advantage:1) With UL,ROHS,ISO,IPC2).Lead time:3-10 working days3)Competitive price best quality4).Rich 20 years experience in High Tg Multilayer PCB . What Information customer need to provide for quotation ?1. PCB Gerber files ,protel,powerpcb,Autocad,etc.2. BOM list for PCB assembly.3. Send us your sample PCB or PCBA.4. OEM is acceptable.  Model Number:XCEPCB008    Shipping port:ShenZhen/HongKong          Place of origin:GuangDong,China    Delivery Time:3-10 Working Days  Production capacity:FR4:2000000Sqms   High Frequency board:10000SqmsPrice Terms:FOBMinimum Order Quantity:1pcPayment terms:TT,Paypal,Western UnionCertification:CE,ROHS,FCC,ISO9008,SGS,ULMaterial:FR4Soldermask:BlackMolde Number:xcepcb008Silkscreen:WhiteLayer:10Panel Size:100*100mm/2pcsBoard Thickness:1.6mmPackage Details:Inner:Vacuum-packed     Bubble bag     With Foam Outer:Carton BoxMin Line Space:4MilMin Line Width:4MilMin Hole Size:10MilFinished Surface:ENIGSpecial requirement:Impedance Control in 50OhmsResin HoleProvide Slice reportFinished Copper:1ozDelivery Time：8 DaysTypical ApplicationsCellular Base Station Antennas and Power AmplifiersMicrowave point to point (P2P) linksAutomotive Radar and Sensorslow dielectric lossBallast, lights, navigationThe stability of the dielectric constantAn extremely low water imbibitionIT industry,Keyboard productsGeneral FR-4 differs from high Tg FR-4: in the hot state, especially in the heat after moisture absorption, the mechanical strength of the material, dimensional stability, adhesion, water absorption, thermal decomposition, differences in thermal expansion and other various conditions, high Tg products significantly better than conventional PCB substrate material.Core ThicknessMin .0025"Maximum PCB Size2 Layer 20" x 28"Mulitlayer 16" x 26"Minimum Conductor Space0.003"Minimum Conductor Width0.003"Minimum Drill Hole Size0.006"Finish Plating / Surface FinishesHASL – Leaded Solder Tin/NickelHASL – Lead Free SolderElectroless Soft GoldWire Bondable Soft GoldNickel Flash GoldElectroless NickelImmersion Gold OSPElectrolytic Nickel /Hard Gold  and Selective GoldImmersion SilverImmersion TinCarbon InkENIGFinished Copper – Outer Layers1oz Cu – Min .004" Trace/Space2oz Cu – Min .005" Trace Space3oz Cu – Min .008" Trace/Space4oz Cu – Min .010" Trace/Space5oz Cu – Min .012" Trace/SpaceWe can manufacture higher ounces of copper depending on the specs. Please let us know how much you would like when sending us your PCB specs.Finished Copper – Inner Layers.5oz Cu – Min .004" Trace/Space1oz Cu – Min .005" Trace/Space2oz Cu – Min .006" Trace/Space3oz Cu – Min .010" Trace/Space4oz Cu – Min .012" Trace/SpaceInner Layer ClearancesMin .008"Minimum Finished Hole Size Final Thickness <=.062" – .006’ Hole Final Thickness .150" – .014" Hole Final Thickness .093" – .010" Hole Final Thickness .200" – .018" Hole Final Thickness .125" – .012" Hole Final Thickness .250" – .020" HoleGold Fingers1 to 4 edgesSolder Mask TypePer IPC-SM-840LPI SoldermaskPeelable SoldermaskSolder Mask ColorsGreen/GreenMatte WhiteBlack/BlackMatte ClearBlue Top and Bottom MixRed One or Both Sides MixSilkscreen TypeThermal Cure Epoxy InkLPI InkSilkscreen ColorsWhiteBlackYellow Top and Bottom MixRed One or Both Sides MixBlueCNC FunctionsScoring Edge to Edge Plated Counter boresSkip Scoring – .250" Spacing Milling30 or 60 Degree Score Angle Blind andBuried Vias30 to 100 Degree Countersink Controlled Z Axis Route15 to 45 Degree Gold Finger Bevel Castellated BarrelsCounterbores Offset or Recessed BevelingPlated CountersinksOther PCB ServicesBlind and Buried ViasPlated Slots Specified DielectricTented Vias Controlled ImpedanceSolder mask Plugged Vias Via Caps (Solder Mask)Conductive Filled ViasQuality / TestingInspect to IPC Class III Continuity Resistance – 10 to 20 OhmsNet List Test per IPC-356D Isolation Resistance – 2 to 30 MegaohmsTest Voltage – 100 to 250 Volts MinimumSMT Pitch 0.5 mmTolerancesPTH Hole Size – +/- .002"Front to Back – +/- .002"NPTH Hole Size – +/- .001"Solder Mask – +/- .002"Tooling Holes – +/- .001"Hole to Pad – +/- .005"Contact Information:Karen-Sales DepartmentShenZhen Xinchenger Electronic Co.,LtdEmail:sales4@xcepcb.comTel:0755-26055813Fax:0755-26055946Skype:karen-xcepcb