14 layer bule soldermask 300*265mm ENIG multilayer customized PCB board   Parameter:No. of LayerUp to 40 layersMaterialFR-4 (Tg≤210, Halogen Free, High Frequency), FR-4 High TgRCC, BT, PEFE, TEFLON, TACONIC, ARLON, High Frequency RogersCEM-1, CEM-3, 22F, Metal Base/Ceramic Base/Aluminum BaseMin. Width/Spacing50um/50umCopper Thickness1/3~12oz (12~420um)Thickness0.1~6.0mm (0.004’’~0.240’’)Min. Hole SpacingPTH (Plated Through Hole)0.10mm (0.004’’)NPTH (Non Plated Through Hole)0.10mm (0.004’’)Surface FinishHASL, HASL Lead Free, OSP, ENIG, Immersion Tin, Immersion SilverNickel Plating, Flash Gold, Gold-Finger, Carbon, Sliver Grout, ENIG, Electroplated soft gold, Electroplated Hard Gold.Special Processing BoardCopper plate edge, Sink hole, Tear ink, FPC14 layer bule soldermask 300*265mm ENIG multilayer customized PCB board：BGA stands for Ball Grid Array (PCB ball grid array structure), it is a large, pin package assembly, four pin QFP and similar, are using SMT solder paste to the circuit board is connected. Their differences are listed in the surrounding "space was the" single-row pin, such as gull wing room to move, room to move flat or retracted abdomen and foot end of the J-; changed to the bottom belly full array or an array of local, the adoption of a two dimensional area of the solder ball pinout, as the chip package on the circuit board solder interconnection tools. It has an area of less packaging, increased functionality, increased pin count, high reliability, good electrical properties, low overall cost.  The outer line of the BGA production:BGA can refer to specifications, design pad size corresponding to the position of a customer to make a standard design BGA BGA array, and then as its benchmarks to be corrected under the BGA and BGA vias were being shot, to be filmed after the original is not shoot before the backup check the level of contrast before and after being shot effect, if BGA pad around large deviations, can not only beat BGA position over the next hole.    Model Number:XCEPCB009   Shipping port:ShenZhen/HongKong          Place of origin:GuangDong,China    Delivery Time:3-10 Working Days  Production capacity:FR4:2000000Sqms   High Frequency board:10000SqmsPrice Terms:FOBMinimum Order Quantity:1pcPayment terms:TT,Paypal,Western UnionCertification:CE,ROHS,FCC,ISO9008,SGS,ULMaterial:FR4Soldermask:BlueMolde Number:xcepcb009Silkscreen:WhiteLayer:14Panel Size:75*65mmBoard Thickness:1.0mmPackage Details:Inner:Vacuum-packed     Bubble bag     With Foam Outer:Carton BoxMin Line Space:4MilMin Line Width:4MilMin Hole Size:10MilFinished Surface:ENIGSpecial requirement:BGAResin holeProvide Slice reportFinished Copper:1ozDelivery Time：8 DaysShenzhen Xinchenger Electronics was a leading manufacturer of high frequency and high difficult pcb circuit board for many years in shenzhen.We have newest pcb machine like laser drill machine,can do min2mil line space and width for you. With these top technology,we can meet all your requirements,such as 24 hours quick sample service,rogers&fr4 mixed compression,4-28 multilayer lamination,crossed blind buried vias hole and so on.Any inquiry can feel free to send us to check if we are able to manufacture your boards.We have professional engineer with more than 10 years pcb working experience can understand all your detail requirements whatever Chinese or English.Gold Fingers1 to 4 edgesSolder Mask TypePer IPC-SM-840LPI SoldermaskPeelable SoldermaskSolder Mask ColorsGreen/GreenMatte WhiteBlack/BlackMatte ClearBlue Top and Bottom MixRed One or Both Sides MixSilkscreen TypeThermal Cure Epoxy InkLPI InkSilkscreen ColorsWhiteBlackYellow Top and Bottom MixRed One or Both Sides MixBlueCNC FunctionsScoring Edge to Edge Plated Counter boresSkip Scoring – .250" Spacing Milling30 or 60 Degree Score Angle Blind andBuried Vias30 to 100 Degree Countersink Controlled Z Axis Route15 to 45 Degree Gold Finger Bevel Castellated BarrelsCounterbores Offset or Recessed BevelingPlated CountersinksOther PCB ServicesBlind and Buried ViasPlated Slots Specified DielectricTented Vias Controlled ImpedanceSolder mask Plugged Vias Via Caps (Solder Mask)Conductive Filled ViasQuality / TestingInspect to IPC Class III Continuity Resistance – 10 to 20 OhmsNet List Test per IPC-356D Isolation Resistance – 2 to 30 MegaohmsTest Voltage – 100 to 250 Volts MinimumSMT Pitch 0.5 mmTolerancesPTH Hole Size – +/- .002"Front to Back – +/- .002"NPTH Hole Size – +/- .001"Solder Mask – +/- .002"Tooling Holes – +/- .001"Hole to Pad – +/- .005"Competitive Advantage:1) With UL,ROHS,ISO,IPC2).Lead time:3-10 working days3)Competitive price best quality4).Rich 20 years experience in High Tg Multilayer PCB . What Information customer need to provide for quotation ?1. PCB Gerber files ,protel,powerpcb,Autocad,etc.2. BOM list for PCB assembly.3. Send us your sample PCB or PCBA.4. OEM is acceptable.  Contact Information:Karen-Sales DepartmentShenZhen Xinchenger Electronic Co.,LtdEmail:sales4@xcepcb.comTel:0755-26055813Fax:0755-26055946Skype:karen-xcepcb