Base material: FR4, FR1, FR2, CEM-1, CEM-3

. Board thickness: 0.30 to 3.20 mm (12 to 26 mil)

. Copper thickness: 0.50 to 5 ounce

. Solder mask: LPI solder mask, conventional solder mask,

  peelable solder mask, UV solder mask

. Minimum line width: 0.1 mm (4 mil)

. Minimum line space: 0.1 mm (4 mil)

. Minimum hole diameter: 0.25 mm (10 mil)

. PTH hole diameter tolerance: 0.076 mm (3 mil)

. NPTH hole diameter tolerance: 0.03 mm (1.2 mil)

. Maximum board size: 460 x 620 mm (18 x 24)

. Board finishing type: hot air leveling, soft gold, hard

  gold, immersion gold, gold fingers

·  Primary Competitive Advantages :

1. Well and High Quality Control
2. Prompt Delivery
3. Customer's Designs and Logos are Welcome
4. Competitive Prices
5. In a Variety of Designs
6. Small Order Acceptable
7. ODM Accepted
8. OEM Accepted