Delivery Time:15-20 working days
Certification:ISO/UL/RoHS

Green Power Supply PCB 2 Layer Double Sided Printed Circuit Board Assembly 
 
 
Specification

Layer: 2 Layer Material: FR4 Board Thickness: 1.0mm Surface Treatment: Lead-Free HASL Solder Mask: Green Size: 288.77 x 197.26mm Copper Thickness: 1.0oZ Min. Line Spacing: 0.75mm Min Trace Space: 1.5mm

 
Huaswin specialized in PCB manufacturing and and PCB Assembly
 
PCBA capabilities: 
Fast prototyping
High mix, low and medium volume build
SMT MinChip:0201
BGA: 1.0 to 3.0 mm pitch
Through-hole assembly
Special processes (such as conformal coating and potting)
ROHS capability
IPC-A-610E and IPC/EIA-STD workmanship operation
 
 
Detailed Specification of PCB Manufacturing
 

1	layer	1-30 layer
2	Material	CEM-1, CEM-3 FR-4, FR-4 High TG,  Polyimide,  Aluminum-based  material.
3	Board thickness	0.2mm-6mm
4	Max.finished board size	800*508mm
5	Min.drilled hole size	0.25mm
6	min.line width	0.075mm(3mil)
7	min.line spacing	0.075mm(3mil)
8	Surface finish	HAL, HAL Lead free,Immersion Gold/  Silver/Tin,  Hard Gold, OSP
9	Copper thickness	0.5-4.0oz
10	Solder mask color	green/black/white/red/blue/yellow
11	Inner packing	Vacuum packing,Plastic bag
12	Outer packing	standard carton packing
13	Hole tolerance	PTH:±0.076,NTPH:±0.05
14	Certificate	UL,ISO9001,ISO14001,ROHS,TS16949
15	Profiling punching	Routing,V-CUT,Beveling

 
PCB Assembly services: 
 
SMT Assembly 
Automatic Pick & Place 
Component Placement as Small as 0201 
Fine Pitch QEP - BGA 
Automatic Optical Inspection 
 
Through-hole Assembly 
Wave Soldering 
Hand Assembly and Soldering 
Material Sourcing 
IC pre-programming / Burning on-line 
Function testing as requested 
Aging test for LED and Power boards
Complete unit assembly (which including plastics, metal box, Coil, cable assembly etc) 
Packing design
 
 
Conformal coating
Both dip-coating and vertical spray coating is available. Protecting non-conductive dielectric layer that is 
applied onto the printed circuit board assembly to protect the electronic assembly from damage due to 
contamination, salt spray, moisture, fungus, dust and corrosion caused by harsh or extreme environments.
 When coated, it is clearly visible as a clear and shiny material.
Complete box build
Complete \'Box Build\' solutions including materials management of all components, electromechanical parts, 
plastics, casings and print & packaging material
 
 
Testing Methods
AOI Testing
Checks for solder paste 
Checks for components down to 0201\" 
Checks for missing components, offset, incorrect parts, polarity
X-Ray Inspection
X-Ray provides high-resolution inspection of: 
BGAs 
Bare boards 
In-Circuit Testing
In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by 
component problems. 
Power-up Test
Advanced Function Test
Flash Device Programming
Functional testing
 
 
Quality Processes: 
1. IQC: Incoming Quality Control (Incoming Materials Inspection)
2. First Article Inspection (FAI) for every process 
3. IPQC: In Process Quality Control
4. QC: 100% Test & Inspection
5. QA: Quality Assurance based on QC inspection again
6. Workmanship: IPC-A-610, ESD
7. Quality Management based on CQC, ISO9001:2008, ISO/TS16949