ISO Automatic OSP Turnkey PCB Assembly Multilayer Printed Circuit Board

Specifications

UL,ROHS,SGS,ISO  Layer: 1-30 layer  Material:CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material.  min.line width:0.075mm(3mil) min.line spacing:0.075mm(3mil) Surface finish:HAL, HAL Lead free,Immersion Gold/ Silver/Tin,Hard Gold, OSP PCB/PCB Assembly manufacturing :OEM/ODM service

Testing Methods

AOI Testing
Checks for solder paste
Checks for components down to 0201\"
Checks for missing components, offset, incorrect parts, polarity

X-Ray Inspection
X-Ray provides high-resolution inspection of:
BGAs
Bare boards

In-Circuit Testing
In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by component problems.
Power-up Test
Advanced Function Test
Flash Device Programming
Functional testing

Huaswin Electronics is a professional PCB & PCB Assembly manufacturer with many years experience in China. Products are applied to a wide range of High-tech industries such as: Telecommunication, computer application, industrial control, power, automobile and high-end consumer electronics, ect. 

A full range of products and services as follows: 

1. Single-sided, double-side & multi-layer PCB 
2. SMT & PTH assembly, COB, DIP, OEM service 
3. Quantities range from prototype to mass production 
4. All boards are electronically tested and shipped with a full set of QA report 
5. Advantage speedy delivery, High reliable, Advanced equipment, Cheap price 

We look forward to your specific enquiries and hope to be your most reliable partner in the near futrue.

Buying from us, you will get the lowest cost and quality guarantee.