Printed circuit board Rigid Flex PCB Assembly 12-Layer , 0.5 - 4 oz Copper   Specifications 1.Printed circuit board,rigid flex pcb assembly
2.UL,ROHS Approval
3.Low Price with High Quality
4.Fast delivery

PCB process capability:

1.Layer:  2-22 layer
2.Product type:  Rigid PCB,High Density Inverter PCB,thick copper PCB
3.Materials:  FR-4, CEM-3, Teflon, Aluminum Substrate, Rogers, Halogen Free, High Tg
4.Copper Thickness:  140micron(4oz)
5.Min Board Thickness:  0.4mm
6.Max Board Thickness:  5.0mm
7.Min finished Hole Diameter:  0.1mm
8.Outer layer line width / spacing:  0.1mm/0.1mm
9.Inner layer line width / spacing:  0.1mm/0.1mm
10.Min aperture:   0.2mm
11.Min Laser drilling:  0.1mm
12.Min  Ring Width:  0.11mm
13.Min BGA-bit hole spacing:  0.4mm
14.Resistance Tolerance:  ±10%
15.Minimum Insulation Thickness:  3mil
16.Maximum laser blind hole thickness to diameter ratio:  0.8:1
17.Maximum working board size:  520*622mm
18.Drilling Tolerance (PTH):  ±0.075mm
19.Drilling tolerance (NPTH):  ±0.05mm
20.Outline Tolerance (CNC):  ±0.13mm
21.Surface coating:  Lead Free HAL, HAL, Flash Gold, Immersion Gold, Immersion Tin, Immersion Silver, OSP, Gold Finger Plating, Carbon Ink Printing, Peelable Blue Mask

PCB board manufacture and PCBA service

* PCB board file with parts list provided by customers

* PCB board made, circuit board parts purchased by us

* PCB board with parts assembled

* Electronic testing circuit board or PCBA

* Fast delivery, anti-static package

* RoHS Directive-compliant, lead-free

* One stop service for PCB design, PCB layout, PCB manufacture, components purchasing, 

PCB assembly, test, packing and PCB delivery

Detailed Terms for Pcb Assembly

 Technical requirement:
1) Professional Surface-mounting and Through-hole soldering Technology
2) Various sizes like 1206,0805,0603 components SMT technology
3) ICT(In Circuit Test),FCT(Functional Circuit Test) technology.
4) PCB Assembly With UL,CE,FCC,Rohs Approval
5) Nitrogen gas reflow soldering technology for SMT.
6) High Standard SMT&Solder Assembly Line
7) High density interconnected board placement technology capacity.

 Quote requirement:
1)Gerber file and Bom list
2)Clear pics of pcba or pcba sample for us
3)Test method for PCBA