Consumer electronic solar air conditioner PCB printed circuit boards assembly FR-4 base   Specifications PCB assembly
1.PCB Manufacture
2.Soon respond&Fast delivery
3.ISO9001/TS16949/IPC/ROHS/UL
4.High Quality,Reasonable Price

Specializing in PCB/PCBA and Electronic components for many years.

6 Rigid-flex PCB;Flex-rigid printed circuit;Fpc/Pcb Manufacture;China Fpc supplier;PCB designer;PCB service 

 We can prvide a package of service: 

· 1. PCB layout, PCB design; 

· 2: Make high difficulty PCB(1 to 38 layers) 

· 3: Provide all Electronic components; 

· 4: PCB assembly;  

· 5: Write programs for clients;  

· 6: PCBA/finished product Test. 

Our advantaged products and service:

PCB Layout,PCBA Factory,HDI PCB,Printed circuit board,BGA PCB,Printed circuit board,Heavy copper PCB,Heavy Au PCB,Heavy Gold PCB,Ceramic PCB,Pottery,PCB.Crockery PCB.FPC,FPCA,Flexible PCB/Printed circuit boards,Flexible PCB assembly. Carbon Oil PCB,Carbon Printed circuit boards.High TG PCB,All Electronic Components,PCB Assembly,Write programs,PCBA test.

Specification for FPC Manufacture:

Item	FPC	PCB	Rigid Flex
Layers	1-8 layers	1-38 layers	2-4 layer
Board Thickness	0.05-0.5mm	0.2-5mm	0.3-2.2mm
Min.line width/space	0.04/0.04mm	0.075/0.075mm	0.1/0.1mm
Min.Through Hole Size	0.2mm	0.25mm	0.5mm
PTH Hole Dia.Tolerance	&≤0.8mm 0.05mm &≥0.8mm ±0.075mm	&≤0.8mm ±0.05mm &≥0.8mm ±0.075mm	&≤0.8mm ±0.05mm &≥0.8mm ±0.075mm
Solder Mask Registration Tolerance	±0.05mm	±0.05mm	±0.05mm
Min.Routing Dimension Tolerance	±0.05mm	±0.1mm	±0.1mm
Hole to edge(Hard tool/Die Cut)	±0.1/±0.2mm
Eege to Edge(Hard tool/Die Cut)	±0.05/±0.2mm
Circuit to edge(Hard tool/Die Cut)	±0.07/±0.2mm
Surface Treating Technology	Electrical Flash Gold,Anti-Tarnish(OSP), Immersion Nickel-gold,HASL,Immersion Tin,

 Details of tech:

 PCB/ PCBA Technic

1).Professional surface mounting and through hole soldering technology;

2).Various sizes,like 1206,0805,0603 components SMT  technology;

3).ICT(In Circuit Test),FCT(Functional Circuit Test)  technology;

4).Nitrogen gas reflow soldering  technology for SMT;

5).High standard SMT&Solder Assembly line;

6).High density interconnected board placement technology capacity.