Model No.:
Product Origin:China
Brand Name:
Price Terms:EXW
Payment Terms:T/T
Certification:
Description:Features: 1) Base material: FR-4, FR-1, FR-2, CEM-1, CEM-3, G-10, base metal laminate 2) Board thickness: 0.30 - 3.20mm (12 - 26mil) 3) Copper thickness: 0.50 - 5oz. 4) Solder mask: LPI solder mask, conventional solder mask, peelable solder mask, UV solder mask 5) Minimum line width: 0.1mm (4mil) 6) Minimum line space: 0.1mm (4mil) 7) Minimum hole diameter: 0.25mm (10mil) 8) PTH hole diameter tolerance: ±0.076mm (±3 mil) 9) NPTH hole diameter tolerance: ±0.03mm (±1.2 mil) 10) Maximum board size: 460 x 620mm (18 x 24) 11) Board finishing type: hot air leveling, soft gold, har gold, immersion gold, gold fingers, carbon ink, cu entek 12) Outline profile: punching, NC routing, punch and push back 13 Outline tolerance: ±0.1mm (±4 mil) 14) Through hole resistance: <300ohms (normal) 15) Solder mask abrasion:>5H 16) E-test voltage: maximum 300V 17) Widely used in telecommunications, computer accessories, vehicle manufacturing and home appliance