Delivery Time:4weeks - 8 weeks
Certification:RoHS, CE, FCC

6 Layer SMT Printed Circuit Board Immersion Gold, FR-4 / Fr-5 SMT Multilayer PCB Board Assembly

PCB assembly:

Consumer, computer, communication, industrial, security, power, traffic control board SMD, DIP, AI OEM/ODM assembly Complete product including plastics, metal works, microchip programming and functional testing process small order, high-mixed accept turn-key service including components procurement, produce, quality check, package, logistics

Fabrication data inputs: Gerber data RS-274-X or RS-274-D with aperture list and drill files, design file with Protel, PAD2000, POWERPCB, ORCAD

Layers 2-30 L Material Types Fr-4, Fr-5, High-Tg, Halogen Free, Rogers, Isola, Taconic, Arlon, Teflon, Aluminum Based Max. Panel Dimension 39000mil * 47000mil / 1000mm * 1200mm Outline Tolerance ±4mil ±0.10mm Board Thickness 8mil-236mil / 0.2mm-6.0mm Board Thickness Tolerance ±10% Dielectric Thickness 3mil-8mil / 0.075mm-0.20mm Min. Track Width 3mil / 0.075mm Min. Track Space 3mil / 0.075mm External Cu Thickness HOZ-6OZ / 17um~210um Internal Cu Thickness HOZ-6OZ / 17um~210um Drilling Bit Size ( CNC ) 6mil-256mil / 0.15mm-6.50mm Finished Hole Dimension 4mil-236mil / 0.1mm—6.0mm Hole Tolerance ±2mil / ±0.05mm Hole Position Tolerance ±2mil / ±0.05mm Laser Drilling Hole Size 4mil / 0.1mm Aspect Ration 12:1 Solder Mask Green, Blue, White, Black, Red, Yellow, Purple, etc. Min Solder mask Bridge 2mil / 0.050mm Plugged Hole Diameter 8mil-20mil / 0.20mm-0.50mm Impedance Control V-scoring ±10% Surface Finishing HASL, HASL(lead Free), Immersion Gold, Immersion Tin, Immersion Silver, OSP, Hard Gold( up to 100u”) UL and TS16949: 2002 marks Special requirements: buried and blind vias, impedance control, via plug, BGA soldering and gold finger Profiling: punching, routing, V-cut and beveling OEM services to all sorts of printed circuit board assembly as well as electronic encased products are provided

We provide total solutions including:

Product development: for single-sided and multilayer PCBA Design: layout and re-layout Tooling: plastic injection molding and metal casting Manufacturing: SMT, BGA and DIP Quality certification: ICT and FCT tests Aftersales services OEM and ODM project is accepted

Equipment in our PCBA facilities includes:

Functional, electrical and in-circuit testing equipment Optical microscopes NC data programming machines Multifunction placement machines Full-vision solder printing machines Full-vision high-sped pick-and-place machines BTU reflow machines Microfocus X-ray fluoroscopy system