Delivery Time:4weeks - 8 weeks
Certification:RoHS, CE, FCC

BGA / DIP/ SMT Car Electronics Pcb Assembly Service, Professional Electronic Circuit Board Assembly

Our services for the PCB Assembly

Metal parts, rubber parts and plastic parts including mold making Mechanical, case and rubber molding assembly Functional testing Repairs and inspection of the sub-finished / finished goods

Key Specifications/Special Features:

BOM Gerber file Assembly drawing with any change notices Dimension specifications for non-standard components Test standard operation procedures Please offer us acceptable components for substitution so as to shorten the lead time If possible, please send prototype sample board to us for further reference. We commit to offer high quality level circuit board to customer Abundant experience and strong ability in material sourcing,manufacturing,test and quality management Professional team in charge of product design Circuit boards 1 to 28 layers PCB layout, fabrication, PCB assembly and box building High-precision 0201 size components SMT technology RoHS complaint SMT, DIP process High-precision e-testing include: ICT in circuit,function test,AOI,BGA repair device and more Flexible production volume follow different customer requirement We offer quotation for clients within 3 working days and reply e-mail within 6 hours

Key Specifications/Special Features:

BOM Gerber file Assembly drawing with any change notices Dimension specifications for non-standard components Test standard operation procedures Please offer us acceptable components for substitution so as to shorten the lead time If possible, please send prototype sample board to us for further reference. We commit to offer high quality level circuit board to customer Abundant experience and strong ability in material sourcing,manufacturing,test and quality management Professional team in charge of product design Circuit boards 1 to 28 layers PCB layout, fabrication, PCB assembly and box building High-precision 0201 size components SMT technology RoHS complaint SMT, DIP process High-precision e-testing include: ICT in circuit,function test,AOI,BGA repair device and more Flexible production volume follow different customer requirement We offer quotation for clients within 3 working days and reply e-mail within 6 hours

Our capabilities for the PCB Assembly

Stencil Size Range	736 mm x 736 mm
Min. IC Pitch	0.30 mm
Max. PCB Size	410 mm x 360 mm
Min. PCB Thickness	0.35 mm
Min. Chip Size	0201 (0.6 mm X 0.3 mm)
Max. BGA Size	74 mm X 74 mm
BGA Ball Pitch	1.00 mm (Min) / F3.00 mm (Max)
BGA Ball Diameter	0.40 mm (Min) /F1.00 mm (Max)
QFP Lead Pitch	0.38 mm (Min) /F2.54 mm (Max)
Frequency of Stencil Cleaning	1 time / 5 ~ 10 Pieces

Our capabilities for handling the Bare PC Board fabrication

Fabrication data inputs: Gerber data RS-274-X or RS-274-D with aperture list and drill files, design file with Protel, PAD2000, POWERPCB, ORCAD

Layers 2-30 L
Material Types Fr-4, Fr-5, High-Tg, Halogen Free, Rogers,
Isola, Taconic, Arlon, Teflon, Aluminum Based
Max. Panel Dimension 39000mil * 47000mil / 1000mm * 1200mm
Outline Tolerance ±4mil ±0.10mm
Board Thickness 8mil-236mil / 0.2mm-6.0mm
Board Thickness Tolerance ±10%
Dielectric Thickness 3mil-8mil / 0.075mm-0.20mm
Min. Track Width 3mil / 0.075mm
Min. Track Space 3mil / 0.075mm
External Cu Thickness HOZ-6OZ / 17um~210um
Internal Cu Thickness HOZ-6OZ / 17um~210um
Drilling Bit Size ( CNC ) 6mil-256mil / 0.15mm-6.50mm
Finished Hole Dimension 4mil-236mil / 0.1mm—6.0mm
Hole Tolerance ±2mil / ±0.05mm
Hole Position Tolerance ±2mil / ±0.05mm
Laser Drilling Hole Size 4mil / 0.1mm
Aspect Ration 12:1
Solder Mask Green, Blue, White, B