SMT BGA Multilayer PCB manufacture
Negotiable /Piece
Min.Order:1000 Pieces
Welcome to Fumax!
SMT BGA Multilayer PCB manufacture
1.Board types: single-sided, double-sided and multilayer printed circuit boards
2.Plastic molding and injection
3.Sheet metal stamping and punching and stamping dies
4.Painting lines
5.Die casting lines
6.Powder coating lines
7.Silkscreen and pad printing
8.High speed SMT and DIP assembly
9.We are capable of providing cost effective and high quality vertical manufacturing services
10.from PCB assembly to final case assembly:
Chip-on-board (COB)
Surface-mount technology (SMT)
Ball-grid array (BGA)
Through-hole
Detailed specification of PCB manufacturing capacity: |
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Surface processing type | HASL/ plating gold /immersion gold/ Ni/Au plating gold finger/OSP processing/immersion Tin (Sn) |
Layers | single-sided,double-sided |
Min trace width | 6mil |
Min space width | 6mil |
Min trace to pad/pad to pad space | 6mil |
Min drill diameter | 0.2mm |
Min via pad | 0.6mm |
Max board size | 560mmX720mm |
Molding board thickness | 0.6-3.00mm |
Min solder mask dam | 6mil |
Min solder mask clearance | 1.5mil |
Min solder mask thickness | 10um |
Solder mask type | Green/yellow/black/red/white/blue or transparent photosensitive solder mask and peel off blue glue. |
Min silk legend width | 6mil |
Min silk legend height | 25mil |
Silk legend color | White/ yellow /black |
Data file format | GERBER file and corresponding drilling file,PROTEL series,PADS2000,POWERPCB series,ODB++ |
Gerber file and Corresponding Broach file, PROTEL series,PADS2000,POWERPCB series, ODB++ | |
Electricity performance testing | 100% electrical performance testing,high pressure testing |
Electricity performance testing | 100%electricity performance testing, high-pressure testing |
Various types base material to PCB processing | High TG board, high frequency board(ROGERS,TEFLON) halogen-free board (FR-4,CEM-1,CEM-3) |
Other testing request | Impendence testing, Hole resistance testing, gold slice up, Solder ability. |