Specifications

BGA Machine
*New model
*With 2 camera vision systems
*Large size bottom IR heating area
*Auto-move optical camera

 Auto BGA Machine with Surveillance Camera

 

Specification

 

Applicable PCB:	W20*D20~W550*D500mm
PCB thickness:	0.5~4mm
Working table adjustment:	±120mm forward/backward, ±80mm left/right
Temperature control:	K-type thermocouple, close cycle controlled
Upper heater(hot air):	1200W
Lower heater(hot air):	800W
Bottom IR heater:	3600W
Power supply:	AC singal-phase 220V 50/60Hz
Applicable BGA:	1*1~70*70mm
Placement precision:	0.01mm
Max BGA weight:	300g
Machine Weight:	90KG
Machine Dimension:	L850*W750*H630mm

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Features

• Three heating systems( upper/lower hot air heater, bottom IR heater) heating independently, time and temperature can be displayed digitally on touch screen;
• Optical vision system can move along with X,Y axis automatically; easy for placement and operation;
• Large movable bottom IR heating area, PCB clamps can be adjusted along with X & Y table flexibly, the max PCB size it can handle up to 550×500mm;
• Powerful cross flow fans cool the bottom heating area rapidly with stable speed.
• Color optical system with functions of split vision, zoom in/out and micro-adjust, equipped with aberration detection device; with auto focus and software operation function, 27 X optical focus, able to rework BGA sized up to 70×70mm;
• Embedded industrial computer, touch screen interface, PLC control, real-time profile display, able to display set profile and 5 practically tested profile at the same time; can analyze the five practically-tested profiles, and compare them with the history saved profiles;with USB for connecting mouse and updating software;
• Color LCD monitor; big size screen, easy to operate;
• Built-in vacuum pump; the max suction up to 80g; 60 °rotation in φ angle,
• 8 segments of temperature up(down) and 8 segments constant temperature control, profile saving is unlimited in the industrial computer;
• Suction nozzle can identify material and mounting height automatically, and can control the air pressure within a small range;
• Auto pick up chip, auto solder, auto remove, auto placement;
• Alloy nozzle assures the durability and stability in reflow, able to locate in any angle;
• Visible monitoring system, can view the melting procee of the balls,(optional).