Heating Device and PCB Clamps:

Independent 3 Heater: Upper/Lower hot air heating, Bottom IR preheating

1.The upper&lower heaters: BGA can be heated from upper and bottom at the same time.

   temperature accuracy within ±2℃,make BGA melt completely;

2.IR preheating area is adjustable according to desire requests and PCB size, and matched with PCB clamps to make PCB          heating evenly and  protect motherboard from deformation during heating process;   

3. PLC operate interface display real-time temperature profile,so you can  monitor BGA temperature change all the time.

4. Unlimited save temperature profile for later use. even if you have no BGA rework experience ,

    You can desoldering/soldering BGA chip.   Easy operation .

5. 8 stages temperature running, Refer Relow soldering process . it is beneficial to know the whole package's temperature   distribution characteristic

PLC Operate Interface:

V-Type PCB Jig

Clamps can help fix PCB on machine ,and it can protect PCB from deformation when heating whole PCB

Thermocouple and Automatically Camera 

Thermocouple :test BGA heating temperature,monitor temperature change

Automatically Camera: it can auto desoldering,auto soldering BGA chip

Optical Camera with laser positioning:

It can display BGA Ball and Pad on the LCD Screen .

so you can make sure BGA Ball and pad  one by one repeat easlier. 

BGA Ball and Pad display on LCD Screen,it can make sure BGA ball and pad one by one repeat.