Product Details

Infrared bga rework station motherboard repair for iphone with high efficient

Main Features

1.Fully automatic optical alignment machine

2.Upper hor air heater head and mounting head 2 in 1

3.Large movable bottom IR bottom heating area

4.Touch screen operation interface

5.LCD display-HDMI 1070P optical alignment imaging

Product Description

Parameters

Applicable PCB Size:W20mm*D20mm ~ W550mm*D500mm
Applicable BGA Size: 1mmX1mm ~ 80mmX80mm

PCB Thickness:0.5~4mm
Max BGA Weight:80g
Upper heater(Hot Air):800W
Lower heater(Hot Air):1200W
Bottom Preheat IR heater:3600W

Temperature Control: K-type Thermocouple ,Close Cycle Controlled

Placement Precision:0.01mm

Min pitch of BGA Ball:0.15mm
Machine Dimension:L720mm*W705mm*H860mm
Machine Weight:70KG
Power supply: AC 220V 5.6KW

Structure Illustration

Three heaters heating independently

Movable Optics

HDMI Digital Imaging 1080P technology

IR wave gilding heater plate with high temperature glass

Flexible PCB jigs , easy to fix

Touch screeng digital display

More specifications

1. Hot air heater head and mounting head are designed 2 in 1, have both the auto soldering and mounting

function;

2. Three heaters( top/spot hot air heater, bottom IR heater) heating independently, with auto protection

function while heating abnormally ,time and temperature can be displayed digitally on touch screen;

3. Top heating system and cooling system are designed 2 in 1, temperature controlled accurately and evenly.

4. Bottom heater is IR wave gilding heater plate, with high temperature glass, temperature increasing and

decreasing rapidly; profile setting accurate to protect the PCB from deformation, easy to solder, energysaving

and environment friendly.

5. Powerful cross flow fans cool the bottom heating area rapidly with stable speed;

6. Color optical system with functions of split vision, zoom in/out and micro-adjust, equipped with aberration

detection device; with auto focus and software operation function,1.3 million pixel high-definition camera.

7. 15’’ high-definition LCD monitor.

8. Both top and spot hot-air heating head can move Z axis automatically, Optical vision system can move

along with X,Y axis automatically, install damping device ,easy operation.

9. Large movable bottom IR heating area, PCB clamps can be adjusted along with X & Y table

flexibly, the max PCB size it can handle up to 550*500mm;

10. Embedded industrial computer, touch screen interface, PLC control, real-time temperature curve display,

able to display temperature curves and practical curves as the same time: can analyze the practically-

tested profile, and compare them with the history saved profiles;

11. Built-in vacuum pump, 60 °rotation in φ angle, mounting nozzle is micro-adjustable;

12. 8 segments of temperature up(down) and 8 segments constant temperature control, profile saving is

unlimited in the industrial computer;

13. Suction nozzle can identify material and mounting height automatically, and can control the air pressure within a small range ;

14. Big size splint, equipped with deformation-proof supporting device, suitable for the accurate rework of all

kinds of PCB;

15. This product has patents: ( heating apparatus ZL 2009 2 0262216.X utility model; 2. top heater

component t ZL 2009 2 0162612.5 utility model; 3.suction nozzle device ZL 2007 2 0127185.8 utility

model; 4. top heating apparatus ZL 200910238919.3 inventive patent.)

BGA reballing tools