1. Preheating PCB to remove moisture to prevent foaming , prevent damage of heat ;

2. Create temperature profiles for de-soldering, soldering; please contact us to get correct profile;

3. Desolder, Remove the BGA/IC from the board ,i.e CPU/GPU ;

4. Residual solder removal ,Remove residual solder from board and component pads;

5. BGA reballing, Attach new soldering balls if the BGA is to be re-used;

6. Alignment, Using RW-SV560A CCD camera to assemble a new BGA or re-used BGA  to board ,

   The camera and 1080P LCD can help you to monitor it . 

7. Solder, Need a proper temperature profile to weld BGA;