Application:
Removal of the surface damage induced by the sawing process. Improvement of the light trapping by the generation of a textured surface.

Features and Benefits

• Using advanced PID temp. control system, Getting Homogeneously textured surface
• Processing of multicrystalline and monocrystalline wafers
• Stable, reproducible process results
• Using auto-dosing system
• Optimised operating costs

Technical Data

• Standard Outline dimension:
  8600*2000*2200 (length*width*heigh)
• Throughput:
  2100 for 125mm wafers/h gross, 1800 for 156mm wafers/h gross
• Thickness: >150um