Manual Copper Wire Plating Production Line
Negotiable /Set
Min.Order:1 Set
Changzhou Techelect Electronic Equipment Co., Ltd.
Features:
It's used for copper plating after the treatment of Black Hole.
Process flow:
Water washing 1 → Water washing 2 → Soak → Copper plating 1→ Copper plating 2
Main technical parameter:
1 | Size of Machine | L8300×W1800×H1980mm | 2 | Production capacity | 1500-2000m2 |
3 | Size of maximal board | 3000mm*1000mm | 4 | Volume of plating tank | L3750×1200×W950mm |
5 | Frequency of waving | 15 times /min | 6 | Rectifier | 200A/2V |
7 | Power voltage | Three-Phase Four-Wire 380 V 50 HZ | 8 | Total power of the machine | 40KW |