Specifications

1.used for the process of double-sided, multilayer lead and tin plate batch etching
2.obtain higher accuracy of circuit graphic

Etching Machine

Process Flow:

Feeding → Four-meter etching 1 → Four-meter etching 2 → Chemical washing → Recycle water washing → Running water washing → Blot up→ Discharge

Application:

Mainly used for the process of double-sided, multilayer lead and tin plate batch etching, which can obtain higher accuracy of circuit graphics.

Main technical parameter:

1	Size of Machine	L12300*W2000*H1980mm	2	Working Height	900mm
3	Working Width	640mm	4	Wheelbase	35mm
5	Running Speed	0.5-5m/min	6	Power voltage	Three-Phase Four-Wire 380 V 50 HZ
7	Total power	75KW	8	Size of minimal board	80*60mm
9	Thickness of outputting board	0.1-3.2mm	10	Running water consuming	8-12L/min