Specifications

Super Thin Plate Etching Machine
1.Precision Double Etching
2.Stripping
3.Each Own Adjust Set
4.High-accuracy & Quick speed

Super Thin Plate Etching Machine

 

Process :

Feeding→ Etching 1 → Etching 2→Recycle Water Washing→Urban Water Washing→Blot Up→Check→Soak→Spraying Stripping→Recycle Water Washing→Urban Water Washing→Blot Up→Hot  Air Drying→Discharge 

 

Advantage:

1. Accept the touched monitor with PLC matched advanced man-machine interface as controller,which more easy to operation,more hommization.
2. Accept the special side window sealing structure,avoid liquid & gas overfall.
3. Accept corrosion resisting diaphragm gauge invidually to control the spraying pressure,control the etching speed from up to down.
4. Top & bottom spraying pipe at etching section use the advanced alternative arrangement style,reduce the transverse  distance between each spray nozzle,increase the spraying contact ratio and even,enhance the etching effect abviously.
5. All the medicinal liquid tank and recycle water tank be designed including double filtering set both with auxiliary cylinder style & outlay style.
6. Drain off water & air-out & winding dispacement be collected together,more beautiful appearance,more tidy environment.

Main Parameter 

1.Worktable Width:640mm(Effective600mm)

2.Worktable Height:900±25mm

3.Convey Speed:0.5-5m/min(Frequency control)

4.Convey Wheel Base:35mm

5.Workpiece Size:Maximum  600mm*Any longer

                            Minmum  80mm*60mm

7.Workpiece Range:FPC(Flex Circuits)≥0.075mm  PCB≥0.8mm

8.Outer Size:L17200*W2400*H1980