Specifications

8 Layer PCB board for mobile phone mother board.
PCB/PCBA manufacturer.
ISO,UL,CE, lead free.
no MOQ.
Years of experiences.

Welcome to Rigao Electronics .CO.,Ltd.

multilayer PCB Assembly manufacturer/OEM  

- Contract Manufacturing

- Mixed-technology (High speed SMT & Through hole assembly)

- PCB Design & Assembly and copy service

- Prototyping

- Components purchasing

- Metal box,Coil,Cable and Wire Assemblies

- Plastics and Molds

 

Our factory:

 

 

 

 

Application

 

Products are applied to a wide range of High-tech industries such as: LED lighting,

 

telecommunication, computer application, lighting, game machine, industrial

 

control, power,automobile and high-end consumer electronics, ect.

 

By unremitting work and effort to the marketing, products exports to American,

 

Canada, Europe counties,Africa and other Asia-pacific countries.

 

Products

 

 

 

 

 

 

 

 

 

Quality Certificates:

 

 Lead free,ISO,UL,CE

 

 

 

 

 

Specs

 

1	Layer	1-22layer
2	Material	FR4, CEM1, Aluminium Base, Cooper Base, High frequency material ,
		Thick copper foil,94-V0 (HB), PI Material, Roger,High TG:SL S1000-2,ITEQ:IT180.
3	Board thickness	0.2mm-7mm
4	Max.finished board side	610mm*1200mm
5	Min.drilled hole size	0.25mm
6	Min.line width	0.1mm(4mil)
7	Min.line spaceing	0.1mm(4mil)
8	Surface finish/treatment	HASL,HASL lead free,OSP,Immersion tin,Immersion Gold,
		Immersion Silver/Gold Finger ,Gold Plating,Selective OSP Immersion Gold
9	Copper thickness	1-6 oz
10	Solder mask color	green/black/white/red/blue/yellow
11	Inner packing	Vacuum packing,Plastic bag
12	Outer packing	Standard carton packing
13	Hole tolerance	PTH:±0.076,NTPH:±0.05
14	Profiling Punching	Routing,V-CUT,Beveling
15	Assembly Service	Providing OEM service to all sorts of printed circuit board