Product Details

Product Description

Electronic components- Voltage Dependent Resistor VDR varistor

Type MYG Varistors are made of semiconductor ceramic materials composed mainly of zinc oxide. They have non-linear resistance that change as a function of applied voltage. It has small size, high current capacity, and high protection level.

PRODUCT:HEL7D121K

Varistor voltage(V1mA):120V/108V-132V

Maximum Allowable voltage:75VAC/100VDC

Maximum Clamping voltage:200V

Withstanding Surge Current(8/20us):1200A/1 time

Rated Wattage(W):0.25W

Energy(2ms):5J

Typical Capacitance:670PF

Ordering Notes:

1. Ceramic Disc: Zinc Oxide Varistor

2. Material of coating: Epoxy resin

3. Material of Leads: CP wire

4. Lead type: Straight lead

5. Package: Bulk pack

Recongnized Certificate:

Function:

Producing Process

Technical Data:

1. Varistors Voltage: The voltage between two terminals with the specified measuring current 1mA DC applied is called V1mA,The measurement shall be made as fast as possible to avoid heat affection.

2.Maximum Continuous AC or DC Voltage:Maximum Continuous AC Voltage 0.62multility varistor voltage.

3. Leakage Current: The current passing through the varistors at the maximum continuous DC voltage.

4.Clamping Voltage:The peak voltage at class current (Standard surge currentwaveform is 8/20μS). The class current is a peak value of current which is1/10 of the maximum peak current for 100 impulses at per minute for 8/20μS.

5.Energy:The maximum energy within the varistors voltage change of ±10% when one impulse of 2ms or 10/1000μS is applied.

For the 2mS waveform:J=2*Ip* Vc*10-3 For the 10/1000μS waveform:

J=1391*Ip* Vc*10-6 Where J -- Energy absorbed in joules.

Ip -- Maximum let-through current in amps.Vc-- Measured clamping voltage in volts.

6.MaximumPeak current : The maximum current within the varistors voltage change of ±10% with the standard impulse current (8/20μS) applied one time.

7. Capacitance: Typical value measured at 1Vrms and test frequency of 1kHz.

8.Solderability: After dipping the terminals to a depth of 3.5-0.5 mm from the body in a soldering bath of temperature 235℃±5℃for 2± 0.5seconds, the terminal shall be visually examined.

9.Resistance to Soldering heat: After each lead shall be dipped into a solder bath having a temperature 260℃±5℃,to a point 2.0 to 2.5mm from the body of the unit. Using shielding Board(t=1.5mm) ,be held there for specified time(5D series: 5±1 seconds and other series:10 s ),and then be stored at room temperature and humidity for 1 to 2 hours. The change of V1mA and mechanical damages are examined.