Specifications

BGA Reflow Oven
1 SMT Equipment
2 With special heater
3 Close loop PID control completely
4 for reflow soldering

BGA Reflow Oven

Features

• With special heater, temperature distribution is even on the surface of panel;
• Close loop PID control completely , temperture is precision and steady;
• Can be used for reflow soldering and preheating of some PCBs, and also for working procedure  needing even heating.

Technical parameter

 

Model	Size(internal)mm L*W*H	Size(external)mm L*W*H	Voltage	Power supply (KW)
101-0	350*350*350	620*700*510	220V	1.0
101-1	450*450*350	720*800*510	220V	2.0
101-2	550*550*450	820*900*620	220V	2.4
101-3	750*600*500	1020*950*680	220V	3.5
101-4	1000*800*800	1320*1150*980	380V	6.0
101-5	1200*1000*800	1520*1350*980	380V	9.0

Other products you may like

BGA Rework Station

 

 

Heat Tape

BGA Flux Paste