Specifications

H803D Solder Paste Thickness Tester
1 Set With Germany CCD Camera
2 SMT machine
3 IC package
4 PCB MARK automatically check

H80 3D Solder Paste Thickness Tester

Features

1. the maximum measuring range 330mm * 300mm (530mm * 460mm) fully meet the requirements of the substrate

2. Automatic plywood  quick positioning without manual adjustment can be described as easier to operate  truly programmable test system

3. looking through the PCB MARK automatically check and correct the offset position

4. A 3-axis automatic movement auto focus  automatic compensation correction substrate warpage solders paste height to obtain accurate figures

5. High-speed Japanese COOL MUSCLE integrated servo system  high speed high precision and powerful SPC statistical analysis software

6. can coordinate when the SMT machine use early warning can automatically generate CP CPK, X-BAR, R-CHART SIGMA column, Trends, control charts etc.

 

 Technical Parameters

Tiptop measure precision(Z)	Height(Z),0.5µm
Repeat precision	Height, below 1.2µm    Volume ,below 0.01
Zoom multiple	50X
Optics inspection system	Germany CCD camera
Laser system	Laser  module with glowing
Auto-system	Full  automaticity
Measure principle	Non-touch laser bean
Scan area (X/Y)	330mm(X) * 300mm(Y) 530mm(X) *460mm(Y)
Max measure height	5mm
Measure speed	Max-150 Profiles / sec
SPC soft	Cp, Cpk, Sigma, Histogram Chat, X bar R&S, Trend, Scatter, Pdata report to Excel & Text
PC system	LCD Windows XP
Language	Simplified Chinese , Traditional Chinese, English
Power	Single-phase AC 220V, 60/50Hz
Weight	75kg
Product shape size	668(W) * 775(D) *374(H) mm
Packing size	790(W)*880(D)*630(H) mm