WDS lead/lead-free BGA Solder Ball bga reballing kits Heat Tape BGA Oven
Negotiable /Parcel
Min.Order:10 Parcels
Shenzhen Wisdomshow Technology Co., Ltd.
WDS lead/lead-free BGA Solder Ball
Technical parameter
diameter(mm) | tolerance(mm) | circularity (mm) | grain / bottle | g/bottle (Net weight) | ||
Sn63/pb37 | Sn62/pb36/Ag2 | Sn96/Ag3.5/o.5Cu | ||||
0.25 | ±0.01 | less than 0.008 | 1000000 | 68.82 | 68.91 | 60.56 |
0.30 | ±0.01 | less than 0.01 | 1000000 | 119.05 | 119.12 | 104.75 |
0.35 | ±0.01 | less than 0.011 | 1000000 | 189.82 | 189.15 | 166.17 |
0.40 | ±0.012 | less than0.012 | 500000 | 140.98 | 141.07 | 124.06 |
0.45 | ±0.012 | less than 0.013 | 500000 | 200.75 | 200.93 | 176.68 |
0.50 | ±0.015 | less than 0.015 | 250000 | 137.73 | 137.86 | 121.20 |
0.55 | ±0.015 | less than 0.016 | 250000 | 183.42 | 188.12 | 161.41 |
0.60 | ±0.018 | less than 0.018 | 250000 | 237.80 | 238.46 | 209.26 |
0.65 | ±0.018 | less than 0.018 | 250000 | 302.71 | 303.58 | 266.38 |
0.70 | ±0.020 | less than 0.020 | 250000 | 378.10 | 378.96 | 332.73 |
0.76 | ±0.020 | less than 0.020 | 250000 | 483.89 | 485.03 | 425.82 |
BGA Reballing Kits
BGA Oven
Lead/Lear-free Solder Ball and Flux
BGA Rework Stations
DS-800A(Full automatic)
WDS-620(Semi automatic and Economical)
Company Details